Shanghai International Thermal Conductive and Liquid cooling technology and Shanghai International New Materials Exhibition


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Date: 2024/12/18 - 2024/12/20

Location: Shanghai

Organizer: Bohan Exhibition (Shanghai) Co., Ltd

Web Site: www.amchinaexpo.cn

Subject:

The 13th Shanghai International Thermal Conductivity and Heat Dissipation Materials and Equipment Exhibition (hereinafter referred to as CIME204) 2024 will be held on December 18-20 at Shanghai Xinguo Expo Center, which is the first exhibition in the global thermal management industry, the exhibition has been held since 2013 and has been successfully held for 11 sessions, and since 2023, the exhibition is scheduled to be held in Shenzhen in June and Shanghai in December. The exhibition is hosted by Bohan Exhibition and Liyue Exhibition, co-organized by Guangdong Adhesive Industry Association and Shenzhen Graphene Association, and has been strongly supported by industry media chambers of commerce, societies and other relevant industry organizations. The exhibition brings together all kinds of thermal conductive fillers, thermal interface materials, carbon materials, graphene, ceramic substrates, high-performance heat dissipation materials, liquid cooling and heat dissipation technology, production and processing equipment and other categories of brand enterprises, providing a one-stop service platform for professional and efficient procurement and business exchanges for people in the thermal control industry. At that time, we warmly welcome domestic and foreign thermal conductivity and heat dissipation material enterprises and related industry people to visit and exchange!

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